2 edition of Techniques for measuring the integrity of passivation overcoats on integrated circuits found in the catalog.
Techniques for measuring the integrity of passivation overcoats on integrated circuits
|Statement||by Werner Kern and Robert B. Comizzoli.|
|Series||Semiconductor measurement technology, Special publication -- 400-31.|
|Contributions||Comizzoli, Robert B.|
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Get this from a library. Semiconductor measurement technology: techniques for measuring the integrity of passivation overcoats on integrated circuits. [Werner Kern; Robert B Comizzoli; United States.
National Bureau of Standards.; United States. Defense Advanced Research Projects Agency.; Radio Corporation of America. Laboratories Division.]. Additional Physical Format: Online version: Kern, Werner, Techniques for measuring the integrity of passivation overcoats on integrated circuits.
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and.
This chapter deals with the synthesis, characterization, and applications of advanced polyimide materials for electronic applications. Aromatic polyimides have been extensively used in microelectronics manufacturing and packaging, especially as passivation layers, dielectrics, or insulator layers in multilayer structures and alpha-particle by: 4.
13 Organic Dielectrics in Multilevel Metallization of Integrated Circuits Krishna Seshan, Dominic J. Schepis, and Laura B. Rothman GENERAL INTRODUCTION We turn our attention now to the interlevel dielectrics used in multilevel metal interconnections, and in particular, organic dielectrics which have recently become the subject of much work due to their unique by: 2.
Full text of "DTIC ADA Semiconductor Measurement Technology" See other formats. Handbook of Thin-Film Deposition Processes and Techniques: Principles, Methods, Equipment and Applications Krishna Seshan New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries.
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Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire () to a substrate (), configuring the wire () into a wire stem () having a springable shape, severing the wire stem (), and overcoating the wire stem () with at least one layer of a material ().Cited by: UH03C2A*  High frequency integrated circuits (UH03C2) *This code is now discontinued, but remains searchable and valid for records from to From see code UH03H for high frequency circuits.
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